A missing 0201 resistor, a hairline solder bridge, or a misread date code on a component won’t fail visibly on the line — it fails later, in the field. Tech Genesys builds high-resolution machine vision inspection for PCB and electronics assembly, verifying board features, component presence, solder quality, markings, alignment, and codes at the resolution fine-pitch electronics demand.
PCB assembly runs at high mix and increasingly fine pitch, where the defects that matter most are the ones no operator can reliably see. A board that passes visually can still fail electrically, in the field, months later.
Solder bridges, tombstoning, and hairline cracks on fine-pitch components are effectively invisible to the naked eye at line speed.
Frequent board and component changeovers increase the chance of wrong-part placement going unnoticed between setups.
A missed defect that passes functional test can still fail after shipment, driving returns and warranty claims.
Customers and OEMs expect inspection results referenced against IPC-A-610 and IPC-A-600 acceptability criteria.
Board-level serialization must be readable and logged to trace a component lot back through a recall or field return.
Shiny solder, dense BGA arrays, and mixed matte/gloss surfaces make lighting and optics selection critical to reliable results.
Each checkpoint below can run at bare-board, post-placement, or post-reflow stage, matched to your board layout and component density.
Verifies trace width, pad geometry, via placement, and copper feature integrity against the board’s reference design.
Confirms every SMD and through-hole component is present, correctly placed, and correctly polarized before and after reflow.
Detects solder bridges, insufficient or excess solder, solder balls, cold joints, and tombstoning at every terminal.
Reads and verifies component markings, polarity indicators, and silkscreen text for legibility and correctness.
Checks component alignment, connector seating, and board registration to fiducials to catch shift and skew before assembly.
Reads board and component serialization — QR, DataMatrix, and barcodes — for genealogy tracking through assembly and shipment.
Detects micron-level scratches, contamination, and coating irregularities on fine-pitch boards where standard resolution isn’t enough.
A bare multi-layer board, a dense BGA module, and a flex circuit each need different optics, lighting angle, and resolution — we match the approach to each.
Post-placement and post-reflow inspection for component and solder defects.
Lead insertion, presence, and solder fillet checks on THT boards.
Bare-board trace, via, and copper feature inspection before assembly.
High-resolution solder and placement checks on dense, fine-pitch packages.
Surface and trace inspection adapted to flexible substrate handling.
Pin alignment, presence, and marking checks on connectors and harnesses.
Share your board layout, component mix, defect history, and required resolution. Our application team will map out the right checkpoints and camera architecture for your line.